Product specifications
HS32 - Power SIP Heatsink
Type ............................................ Board Level, Vertical
Package Cooled ............................... SIP
Attachment Method .......................... Clip
Shape .......................................... Rectangular
Length ......................................... 6.00" (152.40mm)
Width .......................................... 2.953" (75.01mm)
Diameter ....................................... -
Height Off Base (Height of Fin) ............. 1.338" (34.00mm)
Power Dissipation @ Temperature Rise ... -
Thermal Resistance @ Forced Air Flow .... -
Thermal Resistance @ Natural .............. 1.33°C/W
Material ........................................ Aluminum
Material Finish .................................. Black Anodized
- APEX Microtechnology product -