Product specifications
MS06 - Mating socket for IC and Transistor, SIP, 2/pk
Specifications
Contact Finish: .......................... Gold
Contact Finish Thickness: .............. 30µin (0.76µm)
Features: ................................. Closed Frame
Mounting Type: .......................... Through Hole
Number of Positions or Pins (Grid): .... 20 (1 x 20)
Pitch: ...................................... 0.100" (2.54mm)
Type: ...................................... SIP
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